The reason for this is that moving to 12 cores in the CCD would require the normal L3 cache embedded in the chiplet to be increased to 48 MB, from the 32 MB. AMD could stick to using 64 MB for the ...

Advanced Micro Devices, Inc.'s chiplet architecture in CPUs and GPUs ... suggesting AMD could achieve a 17% CAGR by 2028, with a potential EPS increase of 244%. While NVDA is a safer bet, AMD ...

AI hardware startup Axelera AI has unveiled its Titania AI inference chiplet. The company announced the hardware following a €61.6 million ($66.9m) grant from the EuroHPC Joint Undertaking’s (EuroHPC ...

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are ...

Axelera AI, the leading provider of purpose-built AI hardware acceleration technology for generative AI and computer vision inference at t ...

The reason is linked with the five years CAGR, much larger for the group of high-end part ... market deployment of application specific chiplet, with specification based on the high-end data-centric ...

AI hardware maker Axelera AI has unveiled Titania, which the company described as a high-performance, low-power and scalable ...

the Chiplet market is expected to reach more than US$47 Billion by 2031, representing one of the fastest growing segments of the semiconductor industry at more than 40% CAGR from 2021 to 2031.

“Chiplet-based semiconductor design, or system-in-package, presents unique challenges compared to traditional monolithic designs, particularly in signal integrity,” noted Mayank Bhatnagar, product ...

Baya Systems says it has developed a “revolutionary” chiplet-optimized NoC and physical link or PHY interconnect solution that gets around this challenge. Though it’s possible to connect ...

We came across a bullish thesis on Advanced Micro Devices, Inc. (AMD) on Substack by Oliver | MMMT Wealth. In this article, ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA ...