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TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chipsTSMC is set to merge two of its packaging methods — InFO_SoW and System on Integrated Chips (SoIC) — in its system-on-wafer platform. By using the Chip-on-Wafer (CoW) technology, this method ...
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TSMC Announces New System-on-Wafer Process With 3D-StackingThe company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.
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