So said Joseph Bonetti, Principal Engineering Program ... "Many articles say TSMC engineers will come over and share their ...

But, during an investors meeting in April, TSMC CEO Dr. Che-Chia Wei said that the firm will continue using FinFET transistor structure for 3nm process technology. Wei also stated that TSMC's N5 ...

TSMC will see its 3nm node represent over 20 percent of its revenue this year as the node of choice for upcoming processors designed by AMD, Apple, and Intel.… The semiconductor giant's 3nm ...

In a research note with investment firm GF Securities today, analyst Jeff Pu said the A20 chip for the iPhone 18 models will be manufactured with TSMC's third-generation 3nm process, known as N3P.

In one of these notes, it said the A20 chip for the iPhone 18 series would be manufactured with TSMC's third-generation 3nm process, N3P, and in another it said that the chip would use TSMC's ...

Leaks had already suggested that the Tensor G5 would be built using TSMC’s 3nm process. That smaller size and greater transistor density mean that the G5 should be noticeably more powerful than ...

The IP is silicon-proven and available in several foundries and process technologies from 3nm to 22nm. Synopsys GPIO library is designed to support multiple voltages; it offers a complete set of ...

The IP is silicon-proven and available in several foundries and process technologies from 3nm to 22nm. Synopsys GPIO library is designed to support multiple voltages; it offers a complete set of ...

The company's iPhone 15 Pro was the first consumer device to utilize TSMC's 3nm node, and the iPhone 18 Pro will follow that trend late next year. Standard iPhone 18 models will likely employ a ...

If you buy through a BGR link, we may earn an affiliate commission, helping support our expert product labs. To ensure the upcoming iPhone 15 Pro won’t be in short supply, Apple has secured the ...

Marvell has announced IP cores for datacentre ICs using TSMC’s 3nm silicon process for a standards-based silicon platform with die-to-die interface IP and TSMC’s 2.5D Chip-on-Wafer-on-Substrate (CoWoS ...

This milestone was achieved using ... and 3nm process technologies, we deliver robust solutions that go beyond IP. Combined with our expertise in design, package engineering, electrical and ...