Nvidia's GB202 graphics processing unit has a die size of 761.56 mm^2, which makes it one of the largest GPUs for client PCs ...

TSMC management has indicated enormous AI opportunity for its foundry business, particularly for GPUs and ASICs. See why I ...

Remarkable physical flexibility allows the PHY to adapt to each customer’s die floorplan and package constraints, yet is delivered and verified as a single unit for easy timing closure with no ...

Hsinchu, Taiwan – Aug 31, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, disclosed today that its 2 nd generation GLink 2.0 (GUC multi-die interLink) interface, using TSMC 5nm process ...

TSMC's AI demand and robust financial health highlight its growth. Find out why TSM stock, along with DeepSeek’s ...

TSMC started mass production of cutting edge 7nm process two years ago, and this year, it is mass-producing the 5nm process. Most of TSMC's production capacity has already been pre-ordered by ...

and an I/O die in either N5 or even N7, all either stacked or side-by-side in a system-in-package. The N3 processes use what TSMC calls FINFLEX, which allows for variable numbers of fins to have ...

3nm technology will be 30 per cent more energy efficient and 15 per cent faster than the 5nm tech, TSMC says The Taiwan Semiconductor Manufacturing Company (TSMC) expects its advanced 3nm process ...

TSMC credited its positive performance during the fourth quarter to robust 3nm and 5nm chip demand. TSMC reported revenue of NT$2.89 trillion in 2024, representing a 33.9% rise compared to 2023.