Hybrid bonding, already in production using wafer-to-wafer bonding ... multi-chiplet packages are starting to move from high-end applications to more mainstream applications. While TSMC, Samsung and ...

The new platform relies on TSMC's CoWoS and other advanced packaging ... top of another in a face-to-face (F2F) manner using hybrid copper bonding (HCB). This face-to-face (F2F) stacking approach ...