TSMC 3nm process node is the best FinFET technology and TSMC dominates semiconductor chip fabrication with higher transistor ...

Contributor content. The success of TSMC's Arizona venture suggests that America's semiconductor manufacturing revival has ...

Intel admits that it may halt or cancel development of its 14A (1.4nm-class) process node — its first to use High-NA EUV — if ...

GS Microelectronics US, Inc. (GSME), the fastest-growing semiconductor service provider from North America, today announced ...

Intel is currently the only US-based domestic supplier of leading-edge process node technology and advanced packaging capacity, a key advantage as tensions between China and TSMC continue to escalate.

Four new production facilities for TSMC's A14 manufacturing process are being built in Taiwan. Construction work on "Fab 25" is set to begin this year.

TSMC revealed the new process at its North American Technology Symposium on Wednesday in Santa Clara, Calif. Shares edged up 2% during morning market action on Thursday.

In contrast, TSMC's N2 process is not expected to enter high-volume manufacturing until late 2025, with the first commercial products arriving no earlier than mid-2026 and broader market adoption ...

From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April, and the ...

TSMC will begin mass production of its next-gen A16 process technology in the second half of 2026 in Taiwan, while a third Arizona fab is coming in 2028.