This IGAD2DX01A test report shows the functional and characterization test result of GUC Die-to-Die Interface PHY IP for 8 Gbps operation. For IP detailed functional information, please refer to IP ...
IGAD2DX03A is a GLink-3D high speed die-to-die interface Slave PHY. It is used to transmit data between dies and assembled using TSMC System on Integrated Chips (SoIC) 3D stacking technology (3DFabric ...
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