As semiconductors evolve into critical assets for national security and sovereign AI ambitions intensify, TSMC has emerged as ...

--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through ...

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are ...

The Cadence EMX Planar 3D Solver is certified for TSMC’s N3 node and is undergoing N2P certification to meet advanced-node IC demands.

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are ...

HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC for its advanced 5nm and 3nm processes, meeting the rigorous accuracy requirements necessary for designing next-generation ...

This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs. "Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and ...