TSMC is taking the wafer-scale fabrication battle ... it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs.

Monolithic 3D integration ... Fig. 1: TSMC used monolithic integration to stack NFET and PFET devices. [1] Depositing the nanosheet stack is straightforward. Etching it with the precision required is ...

3D IC architectures make this possible in part by pushing Moore ... Because real estate and greenspace must be preserved and intelligently utilized, we build up, creating vertical landscapes rather ...

"Chiplet stacking is a key technology for improving chip performance and cost-effectiveness. In response to the strong market demand for 3D IC, TSMC has completed early deployment of advanced ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

SAN JOSE, Calif. -- October 1, 2013 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today received three TSMC Partner of the Year Awards during TSMC’s ...