To meet these escalating requirements, the industry is pushing the boundaries of advanced-node silicon and 3D-IC technologies. TSMC and Cadence are at the forefront of this revolution, together ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

"Chiplet stacking is a key technology for improving chip performance and cost-effectiveness. In response to the strong market demand for 3D IC, TSMC has completed early deployment of advanced ...

MediaTek and TSMC have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC's N6RF+ process. This achievement makes it possible to ...

3D IC architectures make this possible in part by pushing Moore ... Because real estate and greenspace must be preserved and intelligently utilized, we build up, creating vertical landscapes rather ...