TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a ...

Etching is a fundamental step in semiconductor fabrication, involving the selective removal of material from the wafer ...

In an advancement for next-generation electronics, researchers from the International Center for Quantum Materials at Peking ...

The new WaferWeight measurements may have a resolution as low as 0.1mg. This allows precise tracking of changes in wafer mass between process steps – and also between different wafers in a lot.

That’s when wafers measured an inch or two in diameter. Now, semiconductor makers using advanced process nodes work with 12-inch (300mm) wafers while manufacturers still using older nodes use 8 ...

KLA dominates the semiconductor process control market with 50-80% market share across inspection and metrology segments, ...

As global semiconductor demand soars, Honsu Group – Taiwan’s leading developer and manufacturer of wet process equipment – is scaling up operations, investing in innovation, and preparing ...

Semiconductor device manufacturing involves a complex series of processes that transform raw materials into finished devices. The process typically involves four major stages: wafer fabrication, wafer ...

In this article, AZoNano explores what a semiconductor wafer is, covering its composition, manufacturing process, and the challenges faced in its fabrication. Future development areas for ...

The HPA07 high-performance CMOS semiconductor process from Texas Instruments will foster development of advanced analog chips, including analog-to-digital and digital-to-analog converters, op amps ...