Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S. Due to these changes, certain ...
The 200 series, which includes the GB200 NVL72 and HGX B200, features a dual-die design and is manufactured using CoWoS-L. The 300 series, which includes the GB300 NVL72 and HGX B300 NVL16 ...
Ming-Chi Kuo has debunked rumors of a major reduction in Nvidia's 2025 CoWoS wafer orders at TSMC, confirming expansion ...
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders to major backend ...
Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is ...
TL;DR: TSMC plans to build a third fab in Arizona by mid-2025, a year earlier than planned, and may establish a new CoWoS advanced packaging plant in the US. This expansion is part of TSMC's ...
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...
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