AMD's RDNA 4 architecture and RX 9000-series GPUs launch March 6, beginning with the mainstream to high-end 9070 and 9070 XT. The new chips come with significantly improved ray tracing and AI hardware ...

That slice is dedicated to 1440p gaming, and this unit gives you chiplet-based architecture for ... For the price, you get the more advanced Turing and Ampere architecture, enabling hardware ...

The development contract includes BOS’ s recently introduced Eagle-N (250 TOPS of automotive AI accelerator) and Eagle-A (stand-alone ADAS SoC) in the chiplet system configuration using a high-speed ...

The semiconductor industry is undergoing a transformative shift towards chiplet-based architectures. This is driven by the need for higher functional density and, at the same time, a requirement for ...

JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet builders ...

A new technical paper titled “Garblet: Multi-party Computation for Protecting Chiplet-based Systems” was published by Worcester Polytechnic Institute. “The introduction of shared computation ...

In this paper, we propose DiffChip, a chiplet placement algorithm based on automatic differentiation (AD). The proposed framework relies on a differentiable thermal solver that computes the ...

As the entertainment world continues to evolve post-pandemic, Ampere Analysis’ Guy Bisson offered a compelling look at the global film industry’s current state and its trajectory in 2025 ...

EuroHPC JU DARE project accelerates development of scalable, energy efficient AI inference Titania™ chiplet for high-performance computing, data centers and more. What's new: Axelera AI ...

The development of this chiplet builds on Axelera AI’s innovative approach to Digital In-Memory Computing (D-IMC) architecture, which provides near-linear scalability from the edge to the cloud. To ...

The release of the Assembly, Substrate, Material, and Test Design Kits build on earlier joint efforts between the OCP and JEDEC integrating OCP Chiplet Data Extensible Markup Language (CDXML) ...