This shift comes as HBM and chip-on-wafer-on-substrate (CoWoS) technology growth has begun to slow amid issues related to overheating, power consumption, and cost challenges taking hold.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

HBM-based chip designs are being categorized as AI-related and subject to tighter controls. Over the last few months, there has been a sustained decline in CoWoS advanced packaging orders from ...

TAIPEI (Taiwan News) — Global Unichip Corporation announced Thursday the first universal chiplet interconnect express ...

NVIDIA's chip roadmap progresses from the B200, part of the Blackwell architecture, to the Rubin architecture, with hints of ...

It contains full functional HBM3 Controller and PHY IP and vendor’s HBM3 memory using TSMC’s industry leading CoWoS® technology. HBM memory vendors keep aggressive roadmap increasing throughput and ...

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, just over a month after their last visit. Industry sources speculate ...

Despite market speculation of a major reduction in Nvidia Corporation's NVDA 2025 Chip-On-Wafer-On-Substrate (CoWoS) wafer orders at Taiwan Semiconductor Manufacturing Co TSM, renowned analyst ...