Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment ...
City officials: "We believe more information is coming that will help our community better understand what’s being proposed." ...
After Micron (MU), the world’s third-largest DRAM manufacturer, recently announced a price increase, the other two major DRAM players Samsung ...
SK hynix announces its HBM volume for 2025 has sold out, with final negotiations with customers for HBM supply in 2026 coming ...
This final installment secured critical assets – including intellectual property, research and development resources, and key personnel – enabling SK hynix to fully integrate the NAND ...
Intel completed the second and final closing for a deal to sell its NAND memory fab business in Dalian, China, to SK Hynix.
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Intel and SK hynix close NAND business deal: Intel gets $1.9 billion, SK hynix gets IP and employeesSK hynix's Solidigm can now work more closely with the parent company now that SK hynix finally obtains Intel's SSD IP and R&D capabilities after making final $1.9 billion payment.
SK Hynix has completed the full acquisition of Intel's NAND Flash division, concluding a four-year process. The assets will ...
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