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Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUsWhen Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria, Arizona, it was clear that the company planned to serve TSMC’s customers in the state. Apple is ...
The complete PHY and Controller subsystem was developed in collaboration with TSMC and targets applications such as hyperscaler, high-performance computing (HPC) and artificial intelligence (AI).
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