The new platform relies on TSMC's CoWoS and other advanced packaging ... top of another in a face-to-face (F2F) manner using hybrid copper bonding (HCB). This face-to-face (F2F) stacking approach ...

Semiconductor giants Intel and TSMC are reportedly teaming up. The two firms are said to have reached a tentative agreement to create a joint venture that will operate Intel’s chipmaking ...

TSMC's co-chief operating officer, said at the event for the facility, in which the chipmaker is investing more than 1.5 trillion New Taiwan dollars ($45.2 billion).