the launch of tender offer (the “Tender Offer”) to repurchase its €400m 3.250% hybrid bond (ISIN: XS1716945586) issued on 13 November 2017 with a first call date of 13 November 2025 (“2025 ...

IGMTLSY01A is a synchronous LVTLL / LVT / ULVT periphery high-density ternary content addressable memory (TCAM) with column redundancy feature. It is developed with TSMC 5nm 0.75V/1.2V CMOS ...

Flexible I/O cell for data and clock applications that supports differential (and optionally single-ended) Tx and Rx capabilities with no external components required. See our features list ... Analog ...

As a mild hybrid (eTSI), it does this as often as possible ... Make It the Mexican Way Trump’s tariffs trigger ‘alarming’ bond market fire sale 4 Planets Better For Life Than Earth 12 ...

Every automaker these days offers a hybrid of some sort, and when it comes to small hybrid cars, there is a massive variety to choose from. And it’s not just hatchbacks that come with electric ...

The corporate hybrid bond market has recently drawn the attention of corporate bond issuers, investors and rating agencies. In a falling interest rate environment and generally constructive ...

In one of these notes, it said the A20 chip for the iPhone 18 series would be manufactured with TSMC's third-generation 3nm process, N3P, and in another it said that the chip would use TSMC's ...

The hybrid version of the automaker’s B-segment SUV, which made its global debut in Indonesia back in 2023, will make its first public appearance at the upcoming Bangkok International Motor Show ...

SAN JOSE, California -- Nvidia is not involved in any ongoing negotiations with TSMC about taking over Intel's contract chipmaking business, CEO Jensen Huang said Wednesday.

TSMC is in joint venture talks with Intel to enhance Intel's foundry division, but due to antitrust concerns, a full foundry JV is unlikely to go ahead. A packaging-only JV may be the compromise ...

The Tensor G5 is Google’s first fully self-designed chip, shifting manufacturing to TSMC and blending in select external technologies. Google is blending its own TPU, DSP, and audio processor ...