The Cadence EMX Planar 3D Solver is certified for TSMC’s N3 node and is undergoing N2P certification to meet advanced-node IC demands.

TSMC expects its N3 process to be a long-running and high volume node. TSMC expects its N3 process to be a long-running and high volume node. At the company’s North American Technology Symposium, ...

As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cadence continues to deliver cutting-edge AI-driven design solutions to the TSMC ecosystem for multiple horizontal applications ...

Intel has marked the official launch of its contract chip manufacturing business to compete against Asian foundry giants TSMC and Samsung ... update to its process road map.

Major technologies highlighted at the Symposium include: TSMC FINFLEX™ for N3 and N3E - TSMC’s industry-leading N3 technology, set to enter volume production later in 2022, will feature the ...

Cadence (Nasdaq: CDNS) today announced the industry’s first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution on the TSMC N3 process. The new solution addresses the need for greater memory ...

This enhanced partnership leverages certified design flows, silicon-proven IP and ongoing technical collaboration to drive innovation across TSMC’s most advanced process technologies, including N2P, ...