Ed Snyder of Charter Equity Research dismisses reports that TSMC has pitched an Intel foundry joint venture to Nvidia, AMD and Broadcom. Voter Outrage in California Sparks Political Shift Here's ...

Semiconductor giants Intel and TSMC are reportedly teaming up. The two firms are said to have reached a tentative agreement to create a joint venture that will operate Intel’s chipmaking ...

TSMC, meanwhile, is the world's top contract chipmaker, and thus, the foundation for the venture is looking strong. With Intel's leadership shake-up and a renewed push for US-based chipmaking ...

Intel (INTC) and TSMC (TSM) have reportedly reached a tentative agreement that could revitalize Intel's struggling foundry business. According to the Information, the two companies have agreed to ...

Intel and TSMC have reportedly reached a tentative agreement that could revitalize Intel's struggling foundry business. The two companies have agreed to form a joint venture with other US ...

TL;DR: Intel and TSMC have reached a preliminary agreement for a joint venture, with TSMC managing Intel's US semiconductor fabs. Intel and other US chipmakers will hold the majority stake ...

TSMC held a capacity expansion ceremony for its 2-nanometer chip technology at the Fab 22 facility in Kaohsiung on March 31, 2025, marking a critical step in the company's advanced chipmaking ...

Taiwan Semiconductor Manufacturing Co. has a tentative deal to form a joint venture to operate Intel’s factories, according to a report Thursday in the online tech site The Information.

TSMC, the world's largest contract chipmaker, will take a 20% stake in the new company, the report said. The White House and Commerce department officials have been pressing TSMC and Intel to ...

TL;DR: President Trump announced TSMC's $100 billion investment in US semiconductor manufacturing, raising concerns in Taiwan about losing its global dominance. TSMC reassures that core ...

IGAD2DY02A is a GLink-3D high speed die-to-die interface Master PHY. It is used to transmit data between dies and assembled using TSMC System on Integrated Chips (SoIC) 3D stacking technology ...