Meta and Amazon unveiled new AI chip strategies, while traditional players like Marvell and Micron are seeing momentum in HBM ...

Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration” was published by researchers ...

Cadence Design Systems expressed confidence in its second-half 2025 outlook despite lingering geopolitical uncertainties. In ...

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Ready to put an end to Deltarune's fourth chapter? Dark Sanctuary Three manages to be dark, ominous, and yet still whimsical in places, with plenty of ...

Cadence Design is a leader in electronic design automation, focused on digital and AI applications. Read more on what investors need to know about CDNS.

We propose BBCube 3D, a fully 3D-stacked xPU-on-DRAM architecture that enhances power delivery efficiency for AI and HPC applications. Utilizing wafer-on-wafer (WOW) technology and an integrated Power ...

Broadcom has launched its latest Tomahawk Ultra Ethernet switch chip, fabricated using TSMC's 5nm process, targeting high-performance AI infrastructure with a design aimed squarely at challenging ...

TSMC plans to double its 2nm chip production capacity by 2026, aiming for 90,000 wafers monthly to meet tech giants surging demand.

Welcome Back to the Daily Aviation as we explore the cutting-edge technology behind the F-22 Raptor, the world’s first 5th-generation stealth air superiority fighter. Voice, text and video ...

After setting up its two units in Arizona, TSMC is now on the way to finalize its third unit that will manufacture 2nm tech by 2027.

Interposer technology is essential for electrical connections between dies and components. Among silicon, glass, and re-distribution layer (RDL) interposers, RDL offers improved signal integrity and ...