Cadence Design Systems expressed confidence in its second-half 2025 outlook despite lingering geopolitical uncertainties. In ...

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The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...

Trump says TSMC is a trustworthy company and he is positive about the $100 billion chip manufacturing investment.

CDNS expands its collaboration with TSMC to accelerate time to silicon for advanced-node and 3D-IC technologies.

TSMC has confirmed the existence of a 1.4-nanometer process, that will be used to make future Apple Silicon chips starting in 2028.

“By combining TSMC’s advanced process and 3D stacking and packaging technologies with Cadence’s cutting-edge design solutions, we empower our mutual customers to accelerate time to silicon ...

Cadence today announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3 D-IC and advanced-node technologies through certified design flows, silicon ...

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications.