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Texas Instruments, Intel, Infineon, and NXP lead the IDM pack with the most U.S.-based fabs and high local output. TSMC and ...
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Tom's Hardware on MSNIntel has championed High-NA EUV chipmaking tools, but costs and other limitations could delay industry-wide adoption: ReportIntel has taken an early lead in High-NA EUV lithography, but widespread adoption remains constrained by high tool costs, ...
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