The Global Market for Hybrid Bonding Technology was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during ...

New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

US could fine Taiwan's TSMC NT$33.2 billion for chips in Huawei AI processors Taiwan stabilization fund steps in to support stock market ...

Concerns about AI's energy use have a lot of people looking into ways to cut down on its power requirements. Many of these focus on hardware and software approaches that are pretty straightforward ...

The global data center CPU market is anticipated to expand from USD14156.5 million in 2025 to USD 30085.1 million by 2035. The market is projected to grow at a CAGR of 7.8% during 2025 to 2035 and ...

A new launch date has been revealed for the Huawei Pura 80 series. So, when might the smartphones be released?

The chipmaker's technology was found in Chinese company Huawei's AI processors, which would violate US export control ...

Taiwan Semiconductor Manufacturing faces a host of challenges that have weighed on TSM stock lately. But TSM stock rose ...

Taiwan Semiconductor Manufacturing Company (TSMC) may have to pay a fine of $1 billion or more to resolve a U.S. export ...

During its Cloud Next conference this week, Google unveiled the latest generation of its TPU AI accelerator chip.

This fine will reportedly be in the form of a settlement the semiconductor giant will have to pay as a result of the US ...

The U.S. Department of Commerce is reportedly looking into TSMC's dealings with Sophgo, a chip designer located in China, ...