ST unveils the VNH9030AQ, an integrated full-bridge DC motor driver that can handle a range of automotive applications.

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

GlobalFoundries announces plans to create a new centre for advanced packaging and testing of US-made essential chips.

Intel, the semiconductor giant, is once again the centre of rumours around potential buyers for its struggling chip business.

CES took place in Las Vegas earlier this month and highlighted the latest innovations and new trends for 2025.

The 5G private network has been deployed under a Memorandum of Understanding (MOU) between the National Robotarium and ...

Inelco Hunter has announced the availability of its new 7-inch Touch Display, featuring a 24 Bit RGB interface.

NXP has secured a €1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investment.

The additions include the G9EK-1-UTU and G9EK-1-E which provide compact yet high-capacity gasless interruption for large ...

Altera, a developer of FPGA innovations, has launched the Altera Solution Acceleration Partner (ASAP) Program, an initiative ...

EPC, a leading developer of enhancement-mode gallium nitride (eGaN) power devices, has introduced the EPC91200 design.

BrainChip has announced the availability of its Akida advanced neural networking processor on the M.2 form factor.