Unlike recent years, 2025 has been anything but bullish for Nvidia (NASDAQ:NVDA) so far. The stock has struggled to gain ...

TAIPEI (Taiwan News) — Global Unichip Corporation announced Thursday the first universal chiplet interconnect express ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

NVIDIA's chip roadmap progresses from the B200, part of the Blackwell architecture, to the Rubin architecture, with hints of ...

TAIPEI (Taiwan News) — Memory maker Micron appointed former TSMC Chair Mark Liu (劉德音) as part of its board of directors, the ...

Despite market speculation of a major reduction in Nvidia Corporation's NVDA 2025 Chip-On-Wafer-On-Substrate (CoWoS) wafer orders at Taiwan Semiconductor Manufacturing Co TSM, renowned analyst ...

HBM-based chip designs are being categorized as AI-related and subject to tighter controls. Over the last few months, there has been a sustained decline in CoWoS advanced packaging orders from ...

TSMC is a key partner of the triangular alliance between NVIDIA + SK hynix + TSMC, with the company expected to expand its CoWoS advanced packaging capacity in 2026 to handle the large Rubin chip ...

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This is because advanced packaging technologies such as HBM and "chip on wafer on substrate (CoWoS)" have begun to see technological growth stagnate due to heat generation, power consumption ...

The global AI boom is set to keep high bandwidth memory (HBM) in short supply through 2025, as demand surges across AI and data-intensive applications, according to experts at SEMICON Korea 2025.

This shift comes as HBM and chip-on-wafer-on-substrate (CoWoS) technology growth has begun to slow amid issues related to overheating, power consumption, and cost challenges taking hold. Chipmakers ...