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TSMC Announces New System-on-Wafer Process With 3D-StackingThe company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.
TAIPEI (Reuters) -Advanced Micro Devices said on Tuesday its key processor chips would soon be made at TSMC's new production site in Arizona, marking the first time that its products will be ...
The chip, codenamed Venice, will be the first AMD high-performance computing product developed on TSMC's advanced 2-nanometer process. The company said the chip is scheduled to roll out in 2026.
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