Increasing complexity of semiconductor devices necessitates a fundamental rethinking of defect detection methodologies.

South China Morning Post notes that SiCarrier grabbed headlines in 2023 with a patent for making 5nm chips using DUV tools—a breakthrough linked to Huawei’s 7nm chip in the Mate 60 Pro. According to ...

South China Morning Post notes that SiCarrier grabbed headlines in 2023 with a patent for making 5nm chips using DUV tools—a breakthrough linked to Huawei’s 7nm chip in the Mate 60 Pro. As per Tom’s ...

Global Unichip (GUC), the advanced ASIC company, has announced that it has successfully taped-out the world’s first HBM4 controller and PHY IP. First HBM4 IP taped out on TSMC N3P process Credit: ...

In 2020, TSMC started a special microchip miniaturisation process, called 5nm FinFET technology, that played a crucial role in smartphone and high-performance computing (HPC) development. HPC is the ...