News
North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that ...
SUNNYVALE, Calif., April 23, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close ...
Despite weaker smartphone sales and mounting geopolitical risks, TSMC remains unfazed. Chairman and CEO C.C. Wei reaffirmed ...
The Boston Consulting Group estimates that carbon emissions from semiconductor production could rise by as much as 8% ...
To cope with the strong AI chip demand, TSMC plans to double its advanced packaging, or chip-on-wafer-on-substrate (CoWoS), this year, Wei said, adding that TSMC could not satisfy customers’ demand ...
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According ... FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, ...
TSMC’s CoWoS packaging triples capacity by 2025, enhancing AI chip efficiency and capturing high-margin revenue. While competitors struggle, TSMC is accelerating to 2nm production, securing its ...
TSMC said it was feverishly working to double its CoWoS interposer technology, which among other things, is used to connect HBM stacked memory to high performance compute engines. The demand for CoWoS ...
TSMC's 3nm and 5nm nodes drove 60% of wafer revenue ... reflects an immediate 1% decline due to these overseas costs alongside N2 and CoWoS expansion expenses. The higher cost structure in the ...
Hosted on MSN23d
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacksTSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...
This GPU marks the first commercial implementation of TSMC's CoWoS-L packaging technology, a leap forward in multi-die GPU configurations. As this analysis continues, it sheds light on the ...
Recent reports show that Nvidia alone has secured over 70% of TSMC’s advanced CoWoS packaging capacity for 2025, underscoring the overwhelming demand for next-generation AI GPUs. Shipments of ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results