TSMC is seeking to start construction of its third advanced wafer fab in Arizona soon, Cleveland said. “We have not started to break ground on our third wafer fab in Phoenix. We would like to start ...

Big quote: Former Intel CEO Pat Gelsinger has cast doubt on the effectiveness of TSMC's $100 billion investment in U.S. chip manufacturing, claiming that it will not restore American leadership in ...

Ex-TSMC leaders reflect on challenges and strategy behind US fab push Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Asia Friday 28 March 2025 0 Burn-Jeng Lin (L) and Shang-Yi Chiang (R).

It took TSMC around five years to build the first module of its Fab 21 near Phoenix, Arizona, from groundbreaking to production start. This is significantly longer than the company takes to ...

TAIPEI (Taiwan News) — TSMC’s advanced packaging plants AP8 in Southern Taiwan Science Park and AP7 in Chiayi are set to enter production in the second half of this year, Commercial Times reported ...

The semiconductor giant is likely on schedule to start mass production later this year, with the iPhone 18 Pro's A20 chip bringing the node to consumers in late 2026. TSMC's Kaohsiung plant will ...

Intel Foundry Services (IFS) is looking to compete directly against TSMC in the semiconductor space, with improvements to its advanced packaging technologies like its Embedded Multi-Die ...

The Company's total managed capacity in 2006 exceeded seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, and one six-inch fab. TSMC ...

D/AVE HD is a cost-efficient, highly configurable IP core for 2D and 3D graphics applications. The variants of the core are available for FPGAs, ASICs and SOCs. The high customizability allows ...