Semiconductor giants Intel and TSMC are reportedly teaming up. The two firms are said to have reached a tentative agreement to create a joint venture that will operate Intel’s chipmaking ...

The new platform relies on TSMC's CoWoS and other advanced packaging ... top of another in a face-to-face (F2F) manner using hybrid copper bonding (HCB). This face-to-face (F2F) stacking approach ...