In the last Leo Says, Leo discussed Intel's statement that it would deliver five fabrication nodes in four years. These are bold claims that were immediately challenged by news that Intel would ditch ...

The Cadence EMX Planar 3D Solver is certified for TSMC’s N3 node and is undergoing N2P certification to meet advanced-node IC demands.

This enhanced partnership leverages certified design flows, silicon-proven IP and ongoing technical collaboration to drive innovation across TSMC’s most advanced process technologies, including N2P, ...

That's right folks: buckle up, because we're well into the bumpy roads of sub-nanometer steps in fabrication process improvements. Intel's about to start launching chips fabbed on its 18A process ...

TSMC expects its N3 process to be a long-running and high volume node. TSMC expects its N3 process to be a long-running and high volume node. At the company’s North American Technology Symposium, ...

As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cadence continues to deliver cutting-edge AI-driven design solutions to the TSMC ecosystem for multiple horizontal applications ...

TSMC has unveiled its next cutting-edge logic process technology, A14, at the company’s North America Technology Symposium. Representing a significant advancement from TSMC’s industry-leading N2 ...

In an earnings call, TSMC CEO C.C. Wei dismissed reports that the company was considering a joint venture with Intel and laid out the chipmaker’s plans for its burgeoning US presence.

TSMC's finest manufacturing processes are currently those of the N3 generation, which has been in series production since the end of 2022. There are variants optimized for different areas of ...