The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and ...

Cadence is expanding its design IP portfolio to meet the demands of the AI training market, delivering TSMC 9000-certified IP for 3D-IC design, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E ...

The Cadence EMX Planar 3D Solver is certified for TSMC’s N3 node and is undergoing N2P certification to meet advanced-node IC demands.

Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”), aimed at accelerating time to silicon for ...

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are ...

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are ...

This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs. "Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC for its advanced 5nm and 3nm processes, meeting the rigorous accuracy requirements necessary for designing next-generation ...

Ansys HFSS-IC Pro system-on-chip (SoC) electromagnetic solution is certified for TSMC's 5nm and 3nm process RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC's advanced silicon ...