The recent tariff exemption on semiconductor manufacturing equipment imported from the European Union into the US is poised to significantly influence the US semiconductor industry's landscape, ...

TSMC's first generation of SoW packaging involved mounting just the processing dies to the wafer, whereas the new version ...

TSMC’s exit from GaN fabrication is paving the way for IDM model to take over with a tight design-manufacturing coupling.

We rate Lam’s balance sheet as strong, with net cash and long-dated debt maturities. The company generates strong cash flow and sends most of it back to shareholders, which we like. It targets at ...

Questex’s Sensors Converge and Fierce Electronics announced Lam Research as the winner of the Best Industrial & IIoT Solution ...

In an advancement for next-generation electronics, researchers from the International Center for Quantum Materials at Peking ...

Etching is a fundamental step in semiconductor fabrication, involving the selective removal of material from the wafer ...

Samsung's huge $16.5 billion order for Tesla 2nm chips will be a 'loss-making order' but the semiconductor firm takes it as a ...

Intel Corp. recently indicated that it might give up on its next-generation chip technologies, and some analysts said it could signal a future where the chip maker doesn't have its chip fabrication ...

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Researchers grow single-crystal GaN films on amorphous glass using a chemically converted molybdenum nitride buffer, removing ...

MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI), a leading supplier of semiconductor products, today announced it has assumed full operational control of the wafer fabrication ...