Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S. Due to these changes, certain ...

According to Beth Kindig of I/O Fund, Taiwan Semiconductor Manufacturing Company (NYSE:TSMC)'s CoWoS-L packaging technology is projected to capture 50-60% of the market this year, a significant ...

More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders to major backend ...

The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies. The platform represents real-world CPU/GPU/AI/Networking chips by ...

This milestone was achieved using TSMC's advanced N3P process and CoWoS packaging technologies, targeting AI, high-performance computing (HPC), xPU, and networking applications. In this test chip ...

Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...

We recently published a list of Top 11 AI News and Ratings You Should Take a Look At. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM ...