Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky ...

NOVOSENSE Microelectronics has announced the launch of the NSUC1500-Q1, a highly integrated System-on-Chip (SoC) designed to ...

ETSI releases the first Report that outlines a comprehensive analysis of advanced Integrated Sensing and Communication (ISAC) use cases and deployment scenarios, setting the foundation for future 6G ...

Microchip Technology announces the release of its BR235 and BR235D series of 25A QPL hermetically sealed electromechanical ...

TDK Corporation has expanded its Micronas HVC 5x embedded motor controller family with the HVC 5481G for automotive ...

TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with X7R characteristics (Class Ⅱ ...

Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky ...

STMicroelectronics has introduced two new automotive NFC readers in its ST25R portfolio, delivering superior wake-up and ...

The auto industry is amid two transformative trends: the gradual transition from internal combustion engines (ICE) to ...

RF components such as connectors, cables, antennas, and PCB traces need characterizing so you know how they will perform.

Understand cable impedance: explore the differences between 50-ohm and 75-ohm standards in RF design for improved performance ...

Nexperia announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in ...