Tsuriel Avraham and his colleagues from Ariel University reviewed reliability challenges and models for SiC and GaN power devices.

Indium Corporation, a globally recognized refiner, smelter, manufacturer, and supplier of advanced materials, has officially announced the worldwide release of WS-910 Flip-Chip Flux—a water-soluble ...

Integrating liquid-metal packaging into a SiC half-bridge power module is an innovative solution to longstanding challenges.

At over 100 years old, the automotive industry now faces the challenge of transitioning to sustainable and electric modes of transportation.

NVIDIA’s 800 VDC architecture represents the next generation of power systems, purpose-built to deliver efficient and reliable energy for the megawatt-scale computing infrastructure of the future.