Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Ceramic needles with Luer Lok for conductive epoxies ...

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66% with Nordson Electronics Solutions ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. If you have any questions on your Thermal Warpage and ...

TECHCET reports that in 2024, the materials market reacted to partial recovery in semiconductors, which was strongly driven by revenues for advanced nodes, including ...

The Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor ...

SEMI Southeast Asia is proud to announce the appointment of Dato' Bock KL, Senior Vice President, Global Flash Backend Operations, Sandisk, as the new Chairman of the SEMI ...

Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66+ direct-write lithography system, solidifying its position as the ultimate research ...

Littelfuse, Inc. announced the launch of the 5.0SMDJ-FB TVS Diode Series, a 5000 W surface-mount solution in a DO-214AB package engineered to protect sensitive DC power ... Littelfuse, Inc. announced ...

On July 2 and 3, Plasmatreat celebrated the 30th anniversary of the patent application for its Openair-Plasma technology with its Technology Days 2025 at the headquarters ..

Electronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, ...