CoWoS ®-L is one of the chip-last packages on the CoWoS ® (Chip on Wafer on Substrate) platform. It combines the merits of CoWoS ® -S and InFO (Integrated Fan-Out) technologies to provide the most flexible integration using an interposer with a Local Silicon Interconnect (LSI) chip for die-to-die interconnect and RDL layers for power and ...

CoWoS-L: This uses local silicon interconnect (LSI) along with RDL interposer together forming a reconstituted interposer (RI). In addition to the RDL interposer, it also the preserves the attractive feature of CoWoS-S in the form of through silicon vias (TSVs).

Aug 8, 2024 · CoWoS-L is a back-end chip packaging method within the CoWoS platform that combines the advantages of CoWoS-S and InFO technologies. It uses an LSI chip interposer to provide the most flexible integration for chip-to-chip interconnection and RDL layer power and signal transmission.

Jan 16, 2025 · As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders for CoWoS-S packaging technology.

CoWoS-L provides two kind of LSI die, LSI-1 and LSI-2, the main difference is the interconnect metal scheme.Kelvin structure was designed to investigate the basic electrical

CoWoS®-L For Heterogeneous Integration • Leverage InFO and CoWoS to integrate Si bridge, passives and RDL to best optimize CT, yield learning, system performance and EoS, etc.

Dec 21, 2024 · CoWoS-L Overview: CoWoS-L combines silicon interposer and fan-out technologies to enable flexible integration of chiplets and components. It uses an interposer with LSI (Local Silicon Interconnect) for efficient die-to-die interconnects and RDL (Redistribution Layer) for power and signal delivery.

May 30, 2023 · In this paper, we introduce CoWoS-L, a new architecture in the CoWoS family, to address the large Si interposer defect-driven yield loss concern. The interposer of CoWoS-L includes multiple local Si interconnect (LSI) chip lets and global redistribution layers (RDL) to form a reconstituted interposer (RI) to replace a monolithic silicon ...

CoWoS®-L is one of the last for chip packages in the CoWoS® platform, combining the merits of CoWoS®-S and InFO technologies to provide the most flexible integration using interposer with LSI (Local Silicon Interconnect) chip for die-to-die interconnect and RDL layers for power and signal delivery. The offering starts from 1.5X-reticle ...

Jan 15, 2025 · Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S.